IBM at ECTC 2023

IBM is proud to sponsor the 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) in Orlando, Florida May 30th through June 2.

View all our accepted papers at ECTC 2023.

Visit us in the Coquina Ballroom at Booth # 211 .

Learn more about:

IBM Research in Chiplet and Advanced Packaging Technology​

• Si Carrier for 3DI including laser release​
• Die to Wafer Hybrid bonding​
• DBHi Silicon Bridge​
• Advanced laminates and MCM assembly with mixed bump pitch down to 40um​
• Process optimization enabled with machine learning​
• Modeling and Simulation of Advanced Packaging​ IBM Bromont Expansion plans and OEM Offerings​
• Advanced Flip Chip Assembly and Test​
  • Package size from 15mm to 70mm (Proof of concept up to 105mm)​
  • Die sizes from 2mm x 2mm to 23mm x 32mm​
  • Packaging design supporting : >400 A   ​
  • Thermal solutions supporting : >400 W​
  • Reliability requirements beyond JEDEC standards​
  • Large fleet of UFLEX testers and others​
• Co-packaged Optics​
• System-in-Package (SIP)​
  • Assembly of >400 components per module​
  • Assembly on components on top and bottom surface​

Interested in discussing with our team 1:1 on site how partnering with IBM can benefit your business? Email scott.sikorski@ibm.com to schedule a meeting.