- US
- 11120381
Curtis Grosskopf
Title
STSM - Supply Chain Engr, Components: IC Packaging, Pkg/PWB interaction, RoHS issues, JEDEC JC14.4 chair
Bio
Senior Technical Staff Member, IBM Supply Chain Engineering, -35+ years IC packaging and electronic component assembly -2nd level interaction between electronic components and PWB assembly processes
- Technical lead for IBM Supply Chain Engineering team for environmental (RoHS, REACH, PFAS, etc.) and Pb-free issues
- Chairman JEDEC JC14.4 - Quality Systems
- Co-chair IPC 2-15f - Obsolete and Discontinued Products
- 35+ years involvement in generation of IPC and JEDEC industry standards
Patents
- US
- 10141703
- US
- 9972957
- US
- 9966719
- US
- 9563739
- US
- 9317643
Projects
Finding AI-based solutions to address challenges around materials of concern and their replacement.