Evan Colgan

Evan G. Colgan received a BS in Applied Physics from Caltech in 1982 and a PhD in Materials Science from Cornell in 1987. Dr. Colgan joined IBM, East Fishkill, NY in 1987 and worked on silicides, selective CVD-W, diffusion barriers, and both Cu- and Al-based chip wiring. He transferred to IBM Research as a Research Staff Member in 1995 to manage the TFT Processing Department and subsequently worked on a number of display-related projects, including a LCoS projection display. He joined the Packaging Area in 2001 and has worked on optical packaging, 2.5D and 3D integration, thermal characterization for chip stacks, nanofluidics for DNA translocation, and high-performance liquid cooling. Dr. Colgan was an IBM Master Inventor (2018-2021) and has received five IBM Outstanding Technical Achievement awards and two IBM Outstanding Innovation awards. He has 130 technical publications, 203 issued U.S. patents, and is a member of MRS, Sigma Xi, and a Senior Member of IEEE.