Douglas M. Gill, William Green, et al.
CLEO 2014
We present a silicon photonics optical link utilizing heterogeneously integrated photonic devices driven by low-power advanced 32-nm CMOS integrated circuits. The photonic components include a quantum-confined Stark effect electroabsorption modulator and an edge-coupled waveguide photodetector, both made of III-V material wafer bonded on silicon-on-insulator wafers. The photonic devices are wire bonded to the CMOS chips and mounted on a custom PCB card for testing. We demonstrate an error-free operation at data rates up to 30 Gb/s and transmission over 10 km at 25 Gb/s with no measured sensitivity penalty and a timing margin penalty of 0.2 UI.
Douglas M. Gill, William Green, et al.
CLEO 2014
Fuad E. Doany, Clint L. Schow, et al.
SPIE-P-W 2011
Nicolas Dupuis
PS 2015
Jessie Rosenberg, William M. J. Green, et al.
OFC 2011