PaperPicosecond spin dynamics in dilute magnetic systemsD.D. Awschalom, J.-M. HalboutJournal of Magnetism and Magnetic Materials
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperLight-coupling masks: An alternative, lensless approach to high-resolution optical contact lithographyHeinz Schmid, Hans Biebuyck, et al.Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
