PaperHigh speed silicon lateral trench detector on SOI substrateMin Yang, Jeremy Schaub, et al.Technical Digest-International Electron Devices Meeting
Conference paperNEW RELIABLE STRUCTURE FOR HIGH TEMPERATURE MEASUREMENT OF SILICON WAFERS USING A SPECIALLY ATTACHED THERMOCOUPLE.S. Cohen, T.O. Sedgwick, et al.MRS Proceedings 1983
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperFabrication of Si/SiGe quantum point contacts by electron-beam lithography and shallow wet-chemical etchingU. Wieser, U. Kunze, et al.Physica E: Low-Dimensional Systems and Nanostructures
