Conference paper3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate Katsuyuki Sakuma, Mukta Farooq, et al.ECTC 2021
Conference paperSolving optimization tasks power-efficiently exploiting VO2's phase-change properties with Oscillating Neural NetworksOlivier Maher, N. Harnack, et al.DRC 2023
Conference paperReliable Chiplet Integration on High Density Laminate (2.X D) for AI HardwareDivya Taneja, Jonathan Grenier, et al.ECTC 2024
PaperA 7-nm Four-Core Mixed-Precision AI Chip with 26.2-TFLOPS Hybrid-FP8 Training, 104.9-TOPS INT4 Inference, and Workload-Aware ThrottlingSae Kyu Lee, Ankur Agrawal, et al.IEEE JSSC
