Martin M. Frank, Yu Zhu, et al.
ECS Meeting 2014
One of the greatest challenges for fabricating a Ge channel n-MOSFET is to achieve high n-type dopant activation within the source and drain regions. Currently, p+ doping greater than 1020cm-3 can be routinely achieved which is close to the theoretical solid solubility limit of B in Ge. However, typical n+ doping of Ge is limited to less than 5×1019 which is far below the solid solubility limit of P in Ge. This work is aimed at achieving n+ doping of greater than 10 20cm-3 in Ge. In this paper, we describe a Sb and P co-implantation process to enhance n+ activation in Ge. N-carrier concentration more than 1.0×1020/cm3 has been demonstrated by this method. Furthermore, higher forward bias current in Ge n+/p junction diode is obtained from n+ formation by Sb and P co-implantion, as a consequence of the high n-type dopant activation in Ge. ©The Electrochemical Society.
Martin M. Frank, Yu Zhu, et al.
ECS Meeting 2014
Thomas N. Adam, Stephen W. Bedell, et al.
ECS Transactions
Davood Shahrjerdi, Bahman Hekmatshoar, et al.
Journal of Electronic Materials
Leonardo Massai, Bence Hetényi, et al.
Communications Materials