A 5.6-100K, 128ppm/K Cryo-CMOS Current Reference
Subhajit Ray, David Frank, et al.
VLSI Technology and Circuits 2025
Phased-array modules at frequencies >20 GHz are expected to play an important role for 5G applications. Antenna-in-package (AiP) is a reliable and cost-effective method to realize these phased arrays. This paper introduces a practical Ka-band AiP structure and discusses the antenna element design and implementation tradeoffs. The AiP design is based on multilayer organic buildup substrates that are suitable for phased-array module integration needs and supports both horizontal and vertical polarizations. Measurement results from the fabricated antenna prototypes show 0.8 GHz return loss bandwidth and 3.8-dBi peak gain at 30.5 GHz. Simulation results agree with the measured ones.
Subhajit Ray, David Frank, et al.
VLSI Technology and Circuits 2025
Dipankar Raychaudhuri, Ivan Seskar, et al.
MobiCom 2020
Bodhisatwa Sadhu, Alberto Valdes-Garcia, et al.
RFIC 2016
Benjamin G. Lee, Nicolas Dupuis, et al.
IEEE Photonics Technology Letters