Application of foldy-lax multiple scattering method to via analysis in multi-layered printed circuit board

Abstract

The authors applied Foldy-Lax multiple scattering equations to analyze signal and ground vias in a multi-layered printed circuit board. The Foldy-Lax method solves multiple via coupling between two power/ground planes. It also takes into account physical dimensions of via structures including drill size, anti-pad size and via spacing. Compared with the via models that we presented previously, the Foldy-Lax method is not limited by the shape of power/ground planes. This method produces a network parameter model for each plane pair through which the vias pass. Good model-to-hardware correlation is demonstrated up to 40GHz.