Calculation of multi-port parameters of electronic packages using a general purpose electromagnetics code

Abstract

A powerful code developed by the authors to solve radiation and scattering problems from arbitrary 3D dielectric-conductor structures is modified to provide the terminal characteristics of arbitrary package structures. By incorporating a general de-embedding procedure to eliminate end effects, Y- and S-parameters can be obtained for 3D transmission-line structures; other parameters such as the C and L matrices can also be obtained. Results for microstrip twin-tee and mesh-plane structures are presented and compared with results already in the literature.