Conference paper
Impedance design for multi-layered vias
Xiaoxiong Gu, Albert E. Ruehli, et al.
EPEPS 2008
New concepts are introduced relating aspects of circuit theory to the multicapacitances which can be obtained from a computer program for multiconductor geometries. These concepts are applied to the wiring of an integrated circuit chip. Capacitances are found for crossovers, vias, and right angle bends for a realistic geometry. Copyright © 1975 by The Institute of Electrical and Electronics Engineers, Inc.
Xiaoxiong Gu, Albert E. Ruehli, et al.
EPEPS 2008
Giulio Antonini, Albert E. Ruehli
IEEE TMC
Albert E. Ruehli, Xiaoxiong Gu, et al.
EPEPS 2009
Stefano Grivet-Talocia, Hao-Ming Huang, et al.
IEEE Transactions on Advanced Packaging