S. Kodambaka, J. Tersoff, et al.
Microscopy and Microanalysis
The removal of interfacial silicon dioxide due to the growth of HfO 2 by Hf deposition in an oxidizing ambient was investigated. The involvement of oxygen transport through HfO2 layer was shown by medium-energy ion scattering results. Oxygen vacancy reactions were held responsible for the temperature dependence of silica reduction.
S. Kodambaka, J. Tersoff, et al.
Microscopy and Microanalysis
D.G.J. Sutherland, H. Akatsu, et al.
Journal of Electron Spectroscopy and Related Phenomena
R. Jammy, V. Narayanan, et al.
ISTC 2005
E.A. Stachf, R. Hull, et al.
Philosophical Magazine A: Physics of Condensed Matter, Structure, Defects and Mechanical Properties