Conference paper
Limitations of electromagnetic-based package analysis tools
Barry J. Rubin
IEEE Topical Meeting EPEPS 1994
In this paper we discuss the electrical and physical properties of interconnection structures that impact the performance of computer systems. These considerations are illustrated with three examples of such devices found in a typical mainframe. The requirements for the future are then presented. The ability of new technologies, electrical and optical, for satisfying these requirements is discussed. © Taylor & Francis Group, LLC.
Barry J. Rubin
IEEE Topical Meeting EPEPS 1994
L. Efrat, M. Tismenetsky, et al.
ECTC 1993
G. Arjavalingam, Y. Pastol, et al.
APS 1990
A. Deutsch, M. Swaminathan, et al.
IEEE Topical Meeting EPEPS 1993