Xiaoxiong Gu, Francesco De Paulis, et al.
DesignCon 2009
This paper explores the electrical performance of a recessed probe launch (RPL) technique for measurement of embedded (internal) printed circuit board (PCB) structures such as striplines and vias (plated through holes). The RPL uses high-frequency microprobes in combination with a milling technique that removes upper board layers and exposes internal probing points. A two-tier calibration technique is applied for the extraction of the S-parameters of the RPLs with the help of thru-reflect-line calibration standards designed on PCB. Full-wave models are used to corroborate and validate the obtained S-parameters. Good model-to-hardware correlation is obtained up to 40 GHz. Furthermore, the launch performance with respect to microprobe positioning and variations of the cavity size is investigated using the full-wave models. These simulations suggest techniques for launch optimization and probe modifications that improve the launch measurement bandwidth. © 1963-2012 IEEE.
Xiaoxiong Gu, Francesco De Paulis, et al.
DesignCon 2009
Young H. Kwark, Renato Rimolo-Donadio, et al.
EMC 2014
Sebastian Müller, Fabian Happ, et al.
IEEE Transactions on CPMT
Xiaoxiong Gu, Renato Rimolo-Donadio, et al.
DesignCon 2013