Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperAb initio molecular dynamics simulation of liquids and solutionsMichiel SprikJournal of Physics Condensed Matter
PaperHoles trapped near Mg2+ and Al3+ impurities in SrTiO3O.F. Schirmer, W. Berlinger, et al.Solid State Communications
PaperCatalyst chelation effects in organocatalyzed ring-opening polymerization of lactideDaniel J. Coady, Amanda C. Engler, et al.ACS Macro Letters
