N.F. Pedersen, A. Davidson
Applied Physics Letters
Paper
Flip-chip bonding with solder dipping
Abstract
We report a simple technique for making flip-chip contacts. The equipment required, in addition to a small-scale photoresist clean room, is a beaker of molten solder.
Related
A. Grill, W. Kane, et al.
Journal of Materials Research
A. Davidson, A. Palevski, et al.
Applied Physics Letters
A. Davidson
IEEE Transactions on Magnetics