R. Ghez, J.S. Lew
Journal of Crystal Growth
The performance of devices and circuits is advancing at a rapid pace with submicron design ground rules. The requirements to probe the internal nodes of these ultra-fast, -small, and -dense circuits give rise to great challenges for high speed electron-beam testing. In this paper, we review the development of electron beam testing to achieve simultaneously: 5 ps temporal resolution, 0.1 μm spot size and 3mV/√Hz voltage sensitivity. The newly developed instrument, called the Picosecond Photoelectron Scanning Electron Microscope (PPSEM), is capable of measuring the state-of-the-art bipolar, FET circuits and wiring delays. © 1989.
R. Ghez, J.S. Lew
Journal of Crystal Growth
D.D. Awschalom, J.-M. Halbout
Journal of Magnetism and Magnetic Materials
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SPIE AeroSense 1997
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