R.M. Macfarlane, R.L. Cone
Physical Review B - CMMP
Paper
Initiation of electroless copper plating using Pd+2/poly(acrylic acid) films
Abstract
No abstract available.
Related
Peter J. Price
Surface Science
E. Babich, J. Paraszczak, et al.
Microelectronic Engineering
Sharee J. McNab, Richard J. Blaikie
Materials Research Society Symposium - Proceedings