Conference paper
Thermal instability of the Cu-Ni interface above 200°C
T.H. Westmore, J.E.E. Baglin, et al.
MRS Spring Meeting 1998
Paper
Ion beam enhancement of metal-insulator adhesion
Abstract
Ion beam mixing and substrate surface tailoring may be used to enhance the adhesion at metal-glass, metal-ceramic and metal-polymer interfaces. Some recent publications on the chemical and structural nature of such bonding are reviewed, with special reference to the roles of interface chemistry and morphology. © 1992.
Related
M. Szabadi, P. Hess, et al.
Physical Review B - CMMP
J.E.E. Baglin, A.J. Kellock, et al.
Nuclear Inst. and Methods in Physics Research, B
J.E.E. Baglin, J. Dempsey, et al.
Journal of Electronic Materials