Bodhisatwa Sadhu, Arun Paidimarri, et al.
IEEE Journal of Microwaves
This paper discusses deign considerations for on-chip antennas on high resistivity silicon. For proper design of these antennas, the bulk silicon needs to be divided into three sublayers, namely, inversion, depletion and remaining bulk, with different effective resistivity to account for silicon surface charge.
Bodhisatwa Sadhu, Arun Paidimarri, et al.
IEEE Journal of Microwaves
Jason S. Orcutt, Douglas M. Gill, et al.
OFC 2016
Dong Gun Kam, Duixian Liu, et al.
IEEE MWCL
Duixian Liu, Brian Gaucher
ISAPE 2003