William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010
We have simulated the failure of three-dimensional fcc solids containing voids under mode one tension using molecular dynamics, simple interatomic potentials and a system comprising 15 million atoms. When a linear brittle crack front approaches a void, the void acts to impede the progress of the front by causing dislocation emission, thereby rendering the system ductile. When two voids are alone in the system, failure is via ductility with, first, dislocation loops being emitted from the void surfaces and, then, these loops interacting with one another to form.
William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010
R.D. Murphy, R.O. Watts
Journal of Low Temperature Physics
Imran Nasim, Melanie Weber
SCML 2024
K.A. Chao
Physical Review B