Chengqing Hu, Keun Woo Park, et al.
Journal of Applied Physics
The elastic anisotropy of copper leads to significant variation in the x-ray elastic constants (XEC), which link diffraction-based strain measurements to stress. An accurate depiction of the mechanical response in copper thin films requires a determination of an appropriate grain interaction model that lies between Voigt and Reuss limits. It is shown that the associated XEC weighting fraction, x∗, between these limits provides a metric by which strain anisotropy can be quantified. Experimental values of x∗, as determined by a linear regression scheme of diffraction data collected from multiple reflections, reveal the degree of strain anisotropy and its dependence on plastic deformation induced during in-situ and ex-situ thermal treatments.
Chengqing Hu, Keun Woo Park, et al.
Journal of Applied Physics
Sean M. Polvino, Conal E. Murray, et al.
Applied Physics Letters
Conal E. Murray, Deepika Priyadarshini, et al.
Applied Physics Letters
D. Sil, Yasir Sulehria, et al.
IITC 2021