PaperElectrochemical characterization of adsorption-desorption of the cuprous-suppressor-chloride complex during electrodeposition of copperJohn G. Long, Peter C. Searson, et al.JES
Conference paperNEW RELIABLE STRUCTURE FOR HIGH TEMPERATURE MEASUREMENT OF SILICON WAFERS USING A SPECIALLY ATTACHED THERMOCOUPLE.S. Cohen, T.O. Sedgwick, et al.MRS Proceedings 1983
PaperAnomalous large grains in alloyed aluminum thin films I. Secondary grain growth in aluminum-copper filmsA. Gangulee, F.M. D'HeurleThin Solid Films
PaperScanning tunneling microscopy and spectroscopy of thin metal films on the GaAs(110) surfaceP. Martensson, R.M. FeenstraJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
