Microchip cooling module based on FC72 slot jet arrays without cross-flow

Abstract

In view of the rapid increase of microchip power densities, thermal management has become considerably more challenging. This work presents the first results of an effort aimed at developing a liquid-based cooling module capable of handling high heat fluxes. Four modules 20 × 20 × 2 mm3 in size, containing as many as 120 planar ("slot") jets and a drainage channel system that prevented any cross-flow effect, were tested using FC72 as test fluid. The jet hydraulic diameters were between 173 and 310 μm, with larger drainage channels, 701 to 955 μm in diameter, located between the inlet jets. A custom-made heater resembling an actual microchip was manufactured from silicon and equipped with temperature sensors. The effects of the flow rate, the inlet liquid temperature, the gap between impinged surface and nozzle plate, and different module geometries are discussed. A maximum of 92 W/cm2 was removed at a junction temperature of 85°C using a coolant flow of 1.46 1/min and an inlet temperature of 20°C. ©2006 IEEE.