Microserver system use of optical technologies

Abstract

The DOME microserver project achieves best operations per Joule thanks to ultra-dense packaging and the use of a suitable Server-on-a-Chip. Dense packaging eliminates many PHY chips and also replaces many off-board photonic links with on-board electronic links. Photonic links are, however, required at high density (32 ports) and high speed (40 Gbps) at the rack-unit edge.