PaperELECTROCHEMICAL TECHNOLOGY IN ELECTRONIC INDUSTRY TODAY AND ITS FUTURE: A REVIEW.L. RomankiwOberflache Zurich
Conference paperThe application of electrodeposition processes to advanced package fabricationS. Krongelb, J. Dukovic, et al.SPIE Advances in Intelligent Robotics Systems 1990
PaperPermanent magnet films for biasing of magnetoresistive transducersC.H. Bajorek, D.A. ThompsonIEEE Transactions on Magnetics
Conference paperElectroplated laminated Cu-NiFe films from a single plating bath for inductive recording heads and magnetic shieldsL. Romankiw, J.D. OlsenECS Meeting 1989