Conference paper
Chip-to-chip optical interconnects
J.A. Kash, F.E. Doany, et al.
OFC/NFOEC 2006
The measured crosstalk characteristics for close-packed via fence enclosed differential stripline structures in a standard digital CMOS process are reported. The transmission lines achieve a packing pitch of 16 μm of interconnect width per differential pair. The nearest neighbour far-end differential crosstalk is measured to be better than -43 dB and the near-end differential crosstalk is better than -37 dB below the drive signal at frequencies up to 20 GHz for 600 μm lines. This is sufficient for use in high-density, high-speed analogue and digital integrated circuits. © IEE 2005.
J.A. Kash, F.E. Doany, et al.
OFC/NFOEC 2006
F. Tong, Karen Liu, et al.
LEOS 1994
J.A. Kash, F.E. Doany, et al.
LEOS 2005
J.A. Kash, F.E. Doany, et al.
OFC/NFOEC 2006