O.F. Schirmer, W. Berlinger, et al.
Solid State Communications
A grain-boundary-dislocation mechanism for diffusion-induced boundary migration is proposed. It is suggested that point-defect emission from grain-boundary dislocations is necessary for the solution and transport of substitutional solutes. Grain-boundary migration occurs as a by-product of the emission of point defects, owing to the requirement that the dislocation remain in the grain-boundary plane. © 1981 Taylor & Francis Group, LLC.
O.F. Schirmer, W. Berlinger, et al.
Solid State Communications
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ACS Macro Letters
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SPIE Advanced Lithography 2008
Ming L. Yu
Physical Review B