Publication
SPIE OE/LASE 1990
Conference paper

Optical waveguides in the computer environment a packaging perspective

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Abstract

The integration of optical and electrical functions in the world of high-performance computer packaging is a major challenge. Recent developments in OE chip integration, self-alignment of optical components, and planar processed optical waveguide technologies offer opportunities for meeting this challenge.

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Publication

SPIE OE/LASE 1990

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