Conference paper
Measurement of microbump thermal resistance in 3D chip stacks
E.G. Colgan, Paul Andry, et al.
SEMI-THERM 2012
A mirror structure for reflective Si-based light valves was fabricated using chemical-mechanical polishing and a thin 150-nm Al(Cu)/Ti mirror to minimize hillock formation. The use of chemical-mechanical polishing planarization resulted in only a 1% loss in reflectivity from topography under the mirrors. The reflectivity for pixel sizes from 7.5 to 40 μm and 0.7- or 0.5-μm gaps were measured, and the performance of TN LC pixels with different sizes and inversion methods are reported.
E.G. Colgan, Paul Andry, et al.
SEMI-THERM 2012
John Knickerbocker, Paul Andry, et al.
ECTC 2012
C.L. Schow, L. Schares, et al.
IEEE Photonics Technology Letters
F.E. Doany, B.M. Kuchta, et al.
CLEO 2004