M.S. Cohen, M.J. DeFranza, et al.
ECTC 1993
A novel method for packaging a laser-fiber module is explored in which the critical laser-fiber alignment is carried out not with the usual active means, i.e., with the laser activated, but by a passive method based on the registration principles of photolithography. The new method relies on an index scheme in which fiducial marks are lithographically placed on the laser chip and on a fiber carrier. At 850 nm, using the index technique with cleaved multimode fibers, it has been possible to achieve the same laser-fiber coupling efficiency as attained by active alignment; with cleaved single-mode fibers about 80% of the active-alignment coupling efficiency was achieved. © 1991 IEEE
M.S. Cohen, M.J. DeFranza, et al.
ECTC 1993
J.M. Trewhella, M.M. Oprysko, et al.
ECTC 1996
M.S. Cohen, Glen W. Johnson, et al.
ECTC 1998
J.D. Crow, Joong-ho Choi, et al.
ECTC 1996