Patterning of hyperbranched resist materials by electron-beam lithography

Abstract

The application of hyperbranched polymers as a chemically amplified resist system for exposure by electron-beam (e-beam) is described. These materials incorporate acid labile tert-butyl carbonates (t-BOC) groups on the periphery as the imagable functionality. Exposure by e-beam and subsequent imaging in both the positive and negative tone has been accomplished. Continuous patterns with square profiles and line widths of 100 nm have been patterned in the negative tone. Unfortunately, this particular resist exhibits poor adhesion, and attempts to improve the adhesion have thus far been unsuccessful.