J.H. Stathis, R. Bolam, et al.
INFOS 2005
The feasibility of nano-scale strained-Si technologies for low-power applications is studied. Static and dynamic power for strained-Si device is analyzed and compared with conventional bulk-Si technology. Optimum device design points are suggested, and strained-Si CMOS circuits are studied, showing substantially reduced power consumptions. The trade-offs for power and performance in strained-Si devices/circuits are discussed. Further, analysis and low-power design points are applied and extended to strained Si on SOI substrate (SSOI) CMOS technology. © 2004 Elsevier Ltd. All rights reserved.
J.H. Stathis, R. Bolam, et al.
INFOS 2005
Ming L. Yu
Physical Review B
F.J. Himpsel, T.A. Jung, et al.
Surface Review and Letters
Mitsuru Ueda, Hideharu Mori, et al.
Journal of Polymer Science Part A: Polymer Chemistry