B. Laikhtman, P. Solomon
Journal of Applied Physics
We have developed a method to measure small values of power dissipation in VLSI chips by a thermal method using a Peltier cooler as a thermometer. The temperature rise of <10μK, corresponding to a power dissipation of <1μW, could easily be measured on a chip carrier, with measurement times of a few minutes. A power dissipation of <10nW is measurable for long measurement times. The power of a simple adiabatic output buffer was measured using this method, and the dependence of power dissipation on the square of the load capacitance and frequency was verified.
B. Laikhtman, P. Solomon
Journal of Applied Physics
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IEEE International SOI Conference 2008
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VTS 2024