Joel Silberman, Naoaki Aoki, et al.
IEEE Journal of Solid-State Circuits
Two different refrigeration technologies developed for server applications are described. While mechanical vapor-compression systems solved the refrigeration problems in high end servers and few processor systems, advanced thermoelectric coolers were stated to offer promising solutions for sub-ambient operation of low-end servers, parallel processor systems and extending the temperature differentials in vapor-compression systems. Thin film thermoelectric coolers were described to be ideal for sub-ambient operation of complementary metal oxide semiconductor (CMOS) circuits.
Joel Silberman, Naoaki Aoki, et al.
IEEE Journal of Solid-State Circuits
Z.J. Deng, H. Zhang, et al.
Applied Superconductivity
D. Gupta, B. Amrutur, et al.
IEEE TAS
Uttam Ghoshal, Y.S. Ju, et al.
ICTEC 1999