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PaperSurface crystallography of the c(2×2) sodium overlayer on Al(100)B.A. Hutchins, T.N. Rhodin, et al.Surface Science
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperThermally Developable, Positive Resist Systems with High SensitivityHiroshi Ito, Reinhold SchwalmJES
