Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
Conference paperEffects of KrF laser radiation on fused-silica glass: a comparison of samples exposed in air vs vacuumI.K. Pour, D.J. Krajnovich, et al.SPIE Optical Materials for High Average Power Lasers 1992
PaperSuperconductivity of lanthanum intermetallic compounds with the Cu3Au structureR.J. Gambino, N.R. Stemple, et al.Journal of Physics and Chemistry of Solids
