PaperAb initio molecular dynamics simulation of liquids and solutionsMichiel SprikJournal of Physics Condensed Matter
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
Paper(S)PEEC: Time- and Frequency-Domain Surface Formulation for Modeling Conductors and Dielectrics in Combined Circuit Electromagnetic SimulationsDipanjan Gope, Albert E. Ruehli, et al.IEEE T-MTT
