Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
Conference paperX-ray lithography induced radiation effects in deep submicron CMOS devicesL.K. Wang, A. Acovic, et al.MRS Spring Meeting 1993
PaperLight-coupling masks: An alternative, lensless approach to high-resolution optical contact lithographyHeinz Schmid, Hans Biebuyck, et al.Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
PaperUranium alkoxide chemistryV. Synthesis, characterization and interconversion of uranium(IV) tert-butoxide complexesWilliam G. Van der Sluys, Alfred P. Sattelberger, et al.Polyhedron
