Conference paper
Thermomechanical stress-aware management for 3D IC designs
Qiaosha Zou, Tao Zhang, et al.
DATE 2013
Increased variability affects the efficiency of dynamic power and thermal management. Existing on-chip sensor infrastructure can be used to improve the inherent thermal imbalances among cores in a multicore architecture. Experimental analysis based on live measurements on a special test chip shows reduced on-chip heating with no performance loss. © 2009 IEEE.
Qiaosha Zou, Tao Zhang, et al.
DATE 2013
Guanpeng Li, Karthik Pattabiraman, et al.
SC 2016
Chen-Yong Cher, K. Paul Muller, et al.
ASP-DAC 2014
Pradip Bose, Alper Buyuktosunoglu, et al.
GLSVLSI 2010