Y. Sungtaek Ju, Uttam Ghoshal
Journal of Applied Physics
This paper introduces the concept of a thermo-electromechanical cooler (TEMC), which modifies a traditional thermoelectric cooler (TEC) by using intermittent contact of a mechanical element synchronized with an applied pulsed current. Using Bi2Te3 as the thermoelectric material, it is predicted that the maximum temperature drop across a TEMC may be as much as 35 percent higher than that of a TEC in low heat flux applications. This effectively increases the figure of merit by a factor of 1.8.
Y. Sungtaek Ju, Uttam Ghoshal
Journal of Applied Physics
Andrew Miner, Arun Majumdar, et al.
IMECE 1999
Sandip Kundu, Uttam Ghoshal
EDTC 1997
Li Shi, Arun Majumdar
Microscale Thermophysical Engineering