Physical design challenges for performance
D.P. LaPotin, Uttam Ghoshal, et al.
ISPD 1997
This letter introduces the concept of a thermoelectromechanical cooler (TEMC), which modifies a traditional thermoelectric cooler (TEC) by using intermittent contact of a mechanical element synchronized with an applied pulsed current. Using Bi2Te3 as the thermoelectric material, it is predicted that the maximum temperature drop across a TEMC operated under zero applied heat flux is about 35% higher than that of a TEC. This effectively increases the thermoelectric figure of merit for maximum temperature differential applications by a factor of 1.8. © 1999 American Institute of Physics.
D.P. LaPotin, Uttam Ghoshal, et al.
ISPD 1997
S.D. Posluszny, Naoaki Aoki, et al.
ICCD 1998
A. Majumdar, B. Bhushan
Journal of Tribology
Joel Silberman, Naoaki Aoki, et al.
IEEE Journal of Solid-State Circuits