Julian J. Hsieh
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Thin-film interactions have been increasingly important to various aspects of electronic technologies, including devices and packaging. Extensive outdiffusion and alloy formation, for example, can be detrimental to the yield and reliability of the parts fabricated. Understanding such interactions, and their dependence on various factors, continues to be a challenge to thin-film scientists. Several aspects related to thin-film interactions are described in this paper: A review of the ambient effects that provides an understanding of the basic reaction mechanisms at the interface; an illustration of concerns upon choosing a diffusion barrier layer, and reaction across such a layer; and the effect of undesired outdiffusion on the solder spread related to joining. © 1987, Materials Research Society. All rights reserved.
Julian J. Hsieh
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
J.R. Thompson, Yang Ren Sun, et al.
Physica A: Statistical Mechanics and its Applications
Q.R. Huang, Ho-Cheol Kim, et al.
Macromolecules
Robert W. Keyes
Physical Review B