Conference paper

18 Jun 1992

Three dimensional circuit oriented electromagnetic modeling for VLSI packaging

View publication

Abstract

No abstract available.

Related

Conference paper

Electrical considerations in the computer aided design of logic circuit interconnections

Conference paper

Electrical analysis of interconnections in a solid-state circuit environment

Paper

Inductance of Nonstraight Conductors Close to a Ground Return Plane

Conference paper

An experimental system for power/timing optimization of LSI chips

View all publications