Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
TalkEnhanced Room Temperature Photoluminescence Quantum Yield in Morphology-Controlled J-AggregatesSurendra B. Anantharaman, Joachim Kohlbrecher, et al.MRS Fall Meeting 2020
PaperElectronic Spectra and Structure of Bis(ethylene-1,2-dithiolato)nickel and Bis(propene-3-thione-1-thiolato)nickelZelek S. Herman, Robert F. Kirchner, et al.Inorganic Chemistry
Conference paperIntegration of polymer self-assembly for lithographic applicationJoy Y. Cheng, Daniel P. Sanders, et al.SPIE Advanced Lithography 2008
