Conference paperCharacterization of thin dielectric films as copper diffusion barriers using triangular voltage sweepS. Cohen, J.C. Liu, et al.MRS Spring Meeting 1999
PaperGlassy behaviour in high-Tc superconductorsI. Morgenstern, K.A. Müller, et al.Physica B: Physics of Condensed Matter
PaperElectrochemical characterization of adsorption-desorption of the cuprous-suppressor-chloride complex during electrodeposition of copperJohn G. Long, Peter C. Searson, et al.JES
PaperCrystal structure and cation distribution of MnCrInS4 from synchrotron powder diffraction dataG. Will, N. Masciocchi, et al.Zeitschrift fur Kristallographie - New Crystal Structures