Performance measurement and data base design
Alfonso P. Cardenas, Larry F. Bowman, et al.
ACM Annual Conference 1975
We examine electrical performance issues associated with advanced VLSI semiconductor on-chip interconnections or 'interconnects'. Performance can be affected by wiring geometry, materials, and processing details, as well as by processor-level needs. Simulations and measurements are used to study details of interconnect and insulator electrical properties, pulse propagation, and CPU cycle-time estimation, with particular attention to potential advantages of advanced materials and processes for wiring of high-performance CMOS microprocessors. Detailed performance improvements are presented for migration to copper wiring, low-ε dielectrics, and scaled-up interconnects on the final levels for long-line signal propagation.
Alfonso P. Cardenas, Larry F. Bowman, et al.
ACM Annual Conference 1975
Michael Ray, Yves C. Martin
Proceedings of SPIE - The International Society for Optical Engineering
Oliver Bodemer
IBM J. Res. Dev
Charles H. Bennett, Aram W. Harrow, et al.
IEEE Trans. Inf. Theory