Modeling polarization for Hyper-NA lithography tools and masks
Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2007
Current integrated circuits are large enough that device and interconnect parameter variations within a chip are as important as those same variations from chip to chip. Previously, digital designers were concerned only with chip-to-chip variability, for with analysis techniques exist (e.g. [1, 2]); concern for within-chip variations has been in the domain of analog circuit design. In this paper, we lay the groundwork needed to analyze the impact of inter-chip variations on digital circuits and propose an extreme-case analysis algorithm to efficiently determine the worst case performance due to such variability.
Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2007
John G. Long, Peter C. Searson, et al.
JES
A. Deutsch, H. Harrer, et al.
IEDM 1998
E. Burstein
Ferroelectrics