Thin film transfer process for low cost MCM's
- C. Narayan
- S. Purushothaman
- 1993
- IEMT 1993
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Factors Affecting the Interconnection Resistance and Yield in Multilayer Polyimide/Copper Structures
- Da-Yuan Shih
- Helen L. Yeh
- et al.
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
PROCESSING CONCERNS FOR MULTI-LEVEL THIN FILM METALLIZATION.
- C. Narayan
- J.E. Lewis
- et al.
- 1986
- ECS Meeting 1986